Microelectronics Process Engineer (Optical Products)
Redmond, WA · 1+ years experience · Posted Oct 19, 2026
At a glance
- Experience
- 1+ years experience
- Location
- Redmond, WA
About the role
- The Microelectronics Process Engineer (Optical Products) will develop manufacturing processes for next-generation electro-optic devices for the Starlink satellite constellation.
- This role involves taking products from New Product Introduction (NPI) to high-volume manufacturing by collaborating with design, software, and production teams.
- Key focus areas include microelectronics manufacturing processes such as die attach, wire-bond, AOI, and active alignment.
Responsibilities
- Manage new product introduction and develop production processes for Micro-E assemblies
- Work with machine vendors to procure, operate, and improve device manufacturing equipment
- Design and execute DOE to optimize microelectronic production processes for high volume and high reliability
- Collaborate with design teams and provide design feedback to improve manufacturability and reliability of opto-electronic devices
- Lead investigation on non-conforming hardware to determine root cause and implement reliability improvements
- Work with factory automation teams to bring development processes to high volume production and track product outcomes
- Identify trends and opportunities for optimizing product output, quality enhancements, and cost of manufacturability
- Drive corrective actions and process improvements on owned processes and products
- Create work instructions, SOPs, and administer training for production technicians
Requirements
- Bachelor’s degree in electrical engineering, mechanical engineering, materials science, physics, or other engineering discipline
- 1+ years of hands-on experience working with microelectronics assembly equipment
- Ability to lift heavy objects, up to 25 lbs. unassisted
- Willing to work weekends and extended hours as needed
- Must be a U.S. citizen, lawful permanent resident, refugee, or asylee to conform to U.S. Government export regulations
Preferred qualifications
- Advanced technical degree
- 3+ years of hands-on experience with microelectronics manufacturing processes (die/wire bonding, AOI)
- Hands-on experience with electro-optical device manufacturing
- High volume production experience (consumer goods, automotive, etc.)
- Hands-on experience working in SMT processing and/or related PCBA processes
- Experience with MIL-STD-883, IPC-610 and JEDEC standards
- Experience with environmental testing of electronic devices
- Competency with SQL/Python
Benefits
- Medical, vision, and dental coverage
- 401(k) retirement plan
- Short and long-term disability insurance
- Life insurance
- Paid parental leave
- 3 weeks of paid vacation
- 10 or more paid holidays per year
- Paid sick time
- Long-term incentives (company stock or cash awards)
- Employee Stock Purchase Plan
Workplace
- Company shuttles are offered for roundtrip travel from select Seattle locations to the Redmond office Monday to Friday.
Skills
- Die Attach
- Wire-bond
- AOI
- Active Alignment
- DOE
- SPC
- CAD
- SQL
- Python
- SMT
- PCBA
- MIL-STD-883
Show all 14 skills
- IPC-610
- JEDEC
