Product Engineer, NPI

Santa Clara · USD 170,000-255,000 / year · Onsite · Posted Sep 29, 2026

At a glance

As a Product Engineer specializing in PCBA Manufacturing and DFM, you will drive the end-to-end design manufacturability, quality, and production readiness of next-generation printed circuit board assemblies powering high-performance server and storage systems.
Partnering cross-functionally with Hardware Design, Mechanical Engineering, Test Engineering, and global Contract Manufacturers, you will establish high-yield manufacturing processes, optimize complex stack-ups, and safeguard signal integrity across critical data center hardware.

Direct PCB material selection, multilayer stack-up design, dielectric properties, and fabrication requirements in partnership with hardware designers and fabrication suppliers to maximize signal integrity, ensure impedance control, and eliminate manufacturability risks before release.
Define, optimize, and qualify SMT and mixed-technology assembly processes—including solder paste printing, component placement, reflow, and selective soldering—collaborating with Contract Manufacturers to achieve first-pass yield targets and robust solder joint integrity.
Drive production readiness and defect elimination by deploying and calibrating automated inspection and test strategies (SPI, AOI, X-ray, ICT, and functional test) with test engineering teams, ensuring comprehensive probe access, boundary scan coverage, and rapid root-cause isolation.
Lead comprehensive Gerber, fabrication drawing, assembly, test interaction and BOM reviews in PLM tools to mitigate design risks, optimize assembly hierarchies, and accelerate successful NPI transitions to high-volume manufacturing.
Structure and maintain accurate BOMs in tools such as Agile, including part relationships, revisions, assembly and manufacturing data.

Expertise in PCB Fabrication & Stack-up Design: Mastery of PCB materials, dielectric properties, laminate systems, high-layer-count stack-ups, controlled impedance, and transmission-line behavior (including TDR and S-parameter analysis) for high-speed digital architecture.
Comprehensive SMT & PCBA Manufacturing Skills: Deep technical knowledge of surface-mount technology (SMT) assembly, solder paste printing, reflow profile optimization, pick-and-place process tuning, selective soldering, and IPC standards compliance for high-reliability electronics.
Advanced DFX & CAD Data Analysis: Expertise reviewing Gerber files, drill data, CAM tools, and manufacturing drawings to implement actionable Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Testability (DFT) improvements.
Data-Driven Quality & Inspection Mastery: Hands-on proficiency with process characterization tools including SPI, AOI, X-ray, ICT, test-point strategies, and statistical process control to identify root causes and drive continuous yield improvement.
Cross-Functional & Supplier Leadership: Proven ability to partner effectively with cross-functional hardware teams, test engineers, and global Contract Manufacturers (CMs) to lead pilot builds, qualify suppliers, and resolve complex production challenges.

Primarily an in-office environment expected to work from the Santa Clara office in compliance with company policies.

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