Senior Staff Engineer, Thermal Simulation
San Jose · SSI San Jose · USD 189,000-301,000 · 10+ years experience · Full-time · Onsite · Posted Oct 2, 2026
At a glance
- Experience
- 10+ years experience
- Employment
- Full-time
- Workplace
- Onsite
- Location
- San Jose · SSI San Jose
- Salary
- USD 189,000-301,000 · Base salary
About the role
- We are seeking a highly experience hands-on Senior Staff Thermal Engineer to lead thermal modeling, analysis, and solution development for semiconductors and advanced packaging technologies.
- This role will work closely with Samsung customers and internal engineering customers and internal engineering teams to develop and optimize thermal solutions from early product through detailed modeling and design validation.
Responsibilities
- Lead and perform hands-on thermal modeling and analysis for semiconductor packages, advanced packaging, and electronic systems.
- Build and analyze detailed models using ANSYS Icepak and Siemens Flotherm, including model setup, boundary conditions, solver execution and post-processing.
- Influence the architecture and/or design, materials selection, and structural integrity of the high-performance advanced packaging, and other associated components and collaterals under manufacturing, test, and usage conditions.
- Analyze simulation and measurement results to enhance product reliability.
- Support Samsung customers throughout the product development cycle, from early thermal architecture and feasibility studies to detailed modeling, optimizations, and design recommendations.
- Translate customer requirements and thermal specifications into simulation methodologies.
- Develop best known standards and methodologies and create innovative solutions for challenging semiconductor and packaging applications.
- Communicate technical findings clearly through engineering reports, presentations and customer reviews.
- Stay current with emerging technologies in advanced packaging, HBM, 2.5D/3D integrations, high power computing, and electronics cooling.
Requirements
- Experience in the use of CFD tools such as ANSYS Icepak, Flotherm, CELSIUS and analyzing, debugging, and proposing solutions to resolve various electronic packaging issues observed during assembly, reliability and operation.
- Strong understanding of heat transfer, fluid mechanics, thermal management, and electronics cooling fundamentals.
- Fundamental understanding of IC chip/package architectures and thermal design constraints.
- Working experience in SiP (System in Package) thermal analysis.
- Excellent communication and collaboration skills with demonstrated ability to work effectively in cross functional and cross cultural teams.
Preferred qualifications
- PhD in Mechanical Engineering, Thermal/Fluids, or related Physical Science with 10+ years of Industry Experience is preferred.
Benefits
- Medical/Dental/Vision/401k
- Charitable giving match
- 4+ weeks of paid time off a year, plus holidays and sick leave
- Stipend for fertility care or adoption
- Medical travel support
- Virtual vet care
- On-demand apps and free confidential therapy sessions
- Onsite Café and gym, plus virtual classes
Workplace
- Daily onsite presence at our San Jose headquarters in alignment with our Flexible Work policy
- 10-20% of domestic and international travel
Skills
- ANSYS Icepak
- Siemens Flotherm
- CELSIUS
- CFD Tools
- Semiconductor Packaging
- Advanced Packaging
- Electronics Cooling
- Thermal Simulation
- Thermal Modeling
